• Mentor Embedded Linux Platform Supports Yocto Project

    Updated: 2012-03-30 18:56:58
    Mentor Graphics rolled out the latest release of the Mentor Embedded Linux platform. The latest version of the Mentor Embedded Linux platform supports the Yocto Project, which is an open source collaborative project established by The Linux Foundation. Mentor Graphics is a key contributor to the Yocto Project and OpenEmbedded community. Read more: Mentor Embedded [...]

  • Digi International, Wind River Team on M2M Solution Builder Kit for the Clouds

    Updated: 2012-03-29 18:43:44
    Digi International and Wind River teamed together on the M2M Solution Builder kit, which is a new family of cloud-connected wireless machine-to-machine (M2M) solutions. The kit integrates iDigi Device Cloud with Wind River software. The M2M Solution Builder kits will help developers and OEM’s to quickly build connected products and cloud-enabled services. The M2M Solution [...]

  • Synopsys Announces 3D-IC Initiative

    Updated: 2012-03-27 19:38:29
    Synopsys announced a 3D-IC initiative to accelerate the design of stacked multiple-die silicon systems. The initiative will use 3D-IC integration to meet the requirements of faster and smaller electronic products that consume less power. The Synopsys 3D-IC solution is available now in beta and is expected to be in production next quarter. As part of [...]

  • Cadence VIP Catalog Supports Cloud Computing, 12Gb/s SAS, NVM Express Protocol

    Updated: 2012-03-26 19:50:54
    The Cadence Verification IP (VIP) Catalog now supports the 12Gb/s SAS and NVM Express protocol standards used in cloud computing applications. By doubling the data transfer rate, 12Gb/s SAS improves the cost performance density of SAS interconnects and enables higher degrees of capacity scaling. Pre-silicon verification capabilities, such as those offered by Cadence Design Systems [...]

  • Logic Supply Introduces LGX AG150 Embedded System

    Updated: 2012-03-23 14:43:20
    Logic Supply announced the LGX AG150 embedded system. The AG150 features the new Intel Atom Cedarview N2800 1.86 GHz Dual Core processor, integrated GMA 3650 graphics, 1080p HD graphics, HDMI and VGA, six USB 2.0 ports, two RS-232 COM ports, two PCI Express Mini Card slots and Gb LAN. The LGX AG150 Dual Core Atom [...]

  • e-con Systems Introduces Capella Stereo Vision Camera Reference Design

    Updated: 2012-03-22 16:43:46
    e-con Systems introduced their stereo vision camera reference design (code-named Capella). The new reference design features a DM3730-based Gumstix Overo Water Storm COM, a Gumstix Tobi expansion board and e-con’s camera daughter board (e-CAM_9V024_STEREO). The Capella reference design is the first stereo vision camera reference design based on Texas Instruments’ OMAP/DM37x family of processors and [...]

  • Cadence Announces LPDDR3 Memory IP Solution

    Updated: 2012-03-21 16:11:08
    Cadence Design Systems’ design IP portfolio now includes intellectual property for the LPDDR3 mobile memory standard. As part of the LPDDR3 launch, Cadence has upgraded the bandwidth management engine, Placement Queue 2.2, to optimize the way memory is accessed to improve overall system performance and power consumption. In addition to LPDDR3, Cadence offers IP for [...]

  • Synopsys and Applied Materials Develop Technology Computer-Aided Design Models

    Updated: 2012-03-15 17:21:16
    Synopsys team with Applied Materials to create technology computer-aided design (TCAD) models for next-generation semiconductor devices. The models derived from this TCAD collaboration will enable engineers to speed up process development for 14-nanometer (nm) and 11-nm logic and new memory chip technologies. This will reduce cost and speed time-to-market. Read more: Synopsys and Applied Materials [...]

  • Synopsys, Arteris Team on IP Solution for MIPI Alliance Low Latency Interface

    Updated: 2012-03-12 18:34:27
    Synopsys and Arteris recently teamed on a joint analog and digital IP solution to implement the MIPI Alliance Low Latency Interface (LLI) 1.0 specification. The early integration and availability of the Arteris and Synopsys solution helps speed time to market for MIPI LLI adopters. Arteris and Synopsys’ joint MIPI LLI IP solution is available now [...]

  • SMIC Introduces UHD Library for 0.11um Copper Back End of Line Process

    Updated: 2012-03-08 17:46:09
    Semiconductor Manufacturing International Corporation (SMIC) introduced an ultra high density (UHD) library solution for their 0.11um Cu-BEoL (Copper Back End of Line) manufacturing platform, which can reduce chip size by an average of 31%. SMIC’s 0.11um ultra high density IP solution helps companies lower manufacturing costs and increase market competitiveness. Read more: SMIC Introduces UHD [...]

  • Imec Rolls Out First Process Development Kit for 14nm Logic Chips

    Updated: 2012-03-06 18:25:55
    Imec released an early version of a process development kit for 14nm logic chips. The 14nm PDK was developed as part of imec’s INSITE program, and together with all the partners involved in this collaborative affiliation program. The process development kit will be made available to imec’s partners, and will include incremental updates. In addition, [...]

Current Feed Items | Previous Months Items

Feb 2012 | Jan 2012 | Dec 2011 | Nov 2011 | Oct 2011 | Sep 2011